《國(guó)際應(yīng)用電磁學(xué)與力學(xué)雜志》的宗旨是促進(jìn)應(yīng)用電磁學(xué)、力學(xué)和材料的科學(xué)間耦合。該期刊還旨在促進(jìn)當(dāng)前工業(yè)技術(shù)的進(jìn)一步發(fā)展。該雜志涵蓋的主要課題有:電磁材料和器件的物理和力學(xué)材料和器件中的計(jì)算電磁學(xué)電磁場(chǎng)和材料的應(yīng)用電磁學(xué)、力學(xué)和材料這三個(gè)相互關(guān)聯(lián)的核心學(xué)科包括以下幾個(gè)方面:電磁學(xué)無(wú)損檢測(cè)、電磁學(xué)機(jī)器與設(shè)備、電磁學(xué)材料與結(jié)構(gòu)、電磁流體、磁彈性效應(yīng)與磁溶膠力學(xué)、磁懸浮、電磁推進(jìn)、生物電磁學(xué)以及電磁學(xué)中的逆問(wèn)題。我們的編輯方針是結(jié)合最新的高科技領(lǐng)域的信息和經(jīng)驗(yàn),以及應(yīng)用電磁學(xué)中成熟的技術(shù)。編輯們希望通過(guò)新舊概念的相互作用,在現(xiàn)有理論框架的基礎(chǔ)上加以發(fā)展。為了幫助讀者快速掌握應(yīng)用電磁學(xué)某一特定領(lǐng)域的研究現(xiàn)狀,特刊、補(bǔ)充刊和定期刊均歡迎投稿和邀請(qǐng)投稿。
The aim of the International Journal of Applied Electromagnetics and Mechanics is to contribute to intersciences coupling applied electromagnetics, mechanics and materials. The journal also intends to stimulate the further development of current technology in industry. The main subjects covered by the journal are:Physics and mechanics of electromagnetic materials and devicesComputational electromagnetics in materials and devicesApplications of electromagnetic fields and materialsThe three interrelated key subjects – electromagnetics, mechanics and materials - include the following aspects: electromagnetic NDE, electromagnetic machines and devices, electromagnetic materials and structures, electromagnetic fluids, magnetoelastic effects and magnetosolid mechanics, magnetic levitations, electromagnetic propulsion, bioelectromagnetics, and inverse problems in electromagnetics.The editorial policy is to combine information and experience from both the latest high technology fields and as well as the well-established technologies within applied electromagnetics.The editors hope to build on existing theoretical framework through the interplay of old and new concepts. In order to assist readers to quickly grasping the current status of research in a specific area of applied electromagnetics, both contributed and invited submissions are welcome for publication in special issues, supplemental issues and regular issues.
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